A fluorine-free, formaldehyde-free organic acid bright tin plating solution. The solderability of the plated layer is excellent, even after aging for 16 hours at 155°C. The plated layer is not sensitive to fingerprints. Insensitive to fingerprints, can be used for rack plating or to reduce the metal content of the system for roll plating of electronic components in the field of electrical and electronic engineering, and also for the printed circuit board manufacturing industry, contains specially developed tin additives to minimize the occurrence of double bonding of small electronic components.
