Electroless Tin Sn 30 1 is a process for the chemical tinning of copper or copper alloys by means of charge exchange, which is also suitable for the plating of lead or lead-tin alloys. This bright tin plating on copper surfaces has a thickness of approx. 1 - 2 μm, an operating temperature of 70 °C and the plating also has good solderability after tempering (4h/155 °C) Chemical Tin Tin Sn 30 1 is a renewable plating solution and the accumulated copper in the plating solution can be separated during operation. The components required for deposition can be replenished on the basis of an analysis. Therefore, it is not necessary to configure the plating solution in the usual way for conventional tin dipping processes. The additives required for plating solution replenishment and operation do not contain any alkylphenol ethoxylates (nonylphenol ethoxylates). The data in this table are based on laboratory analyses and actual production experience. The information is intended only as a guide for operating conditions and reagent dosages, which depend on the composition of the plated part (material, geometry, etc.), the application and the production conditions in the plant.
